TeraLink™ Interconnect Engineering

 

The Teralink™ interconnect engineering[1] design methodology represents the state-of-the-art in wave guide engineering applied to digital transmission channels. Teraspeed Consulting Group's staff evaluate the entire channel as an integrated whole from silicon die source to silicon die receiver, yielding: highly reliable, and incredibly fast channels, that are both dense and require minimum production cost for the performance needed.

We apply our expertise to all significant channel design detalis including:

This complete methodology yields channel models of unparalleled accuracy, and enables "right by design" results. We utilize the current state-of-the-art 3D field sovers, modeling environments, and methods that are appropriate to any given design challenge. We thoroughly validate theoretical results with carefully correlated measurements. Our Teralink™ methodology insures that channels perform optimally not only in simulation, but where it counts: day in and day out in the real world.

Countless leading edge digital designs, done right by design, to 40GHz and beyond, testify to our design and service excellance. Whether your needs are: IC package, connector, backplane, daughter card, or end-to-end channel development, you owe it to yourself to get the most out of your product with the Teralink™ advantages of: highest performance and reliability at the lowest possible cost.

 

[1] S. McMorrow, R. Hinz, "Interconnect Engineering," Printed Circuit Design, p.16, March 2002.

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