Teraspeed - Experience

Experience

Teraspeed® Consulting's engineering and design experience spans the breadth of the electronics, computer and communications industries. Leverage our expertise in the following areas:

Network Switch Fabric

Switch-fabric card, backplane and system development at 10 Gbps, 3.125 Gbps, 2.5 Gbps, XAUI, OC-48, OC-192 and OC768 rates.
3.125, 10 and 40 Gbps switch fabric design and implementation.
Telecom backplane implementation.

Packaging

OC-192, 10 Gbpswire-bond package design and characterization.
3.125 XAUI package design and characterization.
Modeling, characterization and optimization for wire-bond, flip-chip and MCM packaging
Custom, semi-custom and ASIC buffer optimization for signal integrity, power and performance.

System

Interconnect modeling, simulation and measurement methodology development.
Validation platform engineering for connector, package and device characterization at frequencies to 20 GHz.
Modeling, simulation and correlation to measurement of 10 Gbps systems.
Bus modeling, routing and optimization of DDR-400, Rambus-533, McKinley SP multi-processor link, PCI-X 133, multi-point LVDS backplane, 3.125 Gbps point-to-point switch fabric interconnect.

Modeling

2D, 3D, full-wave, SPICE, IBIS modeling and characterization of:
- Wire-bond and flip-chip packaging
- Multi-chip Modules (MCM)
- Printed Circuit Board substrates (PCB)
- Advanced materials (Rogers, Nelco, Taconic, Dupont ...)
- Connectors
- Vias
- Lossy Interconnects
- Complete system interconnect

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