solutions using our comprehensive TeraPower™ PDS development methodology.

Teraspeed® Consulting Group develops IC and passive component package AccuModel™ SPICE from full 3-D electromagnetic simulations and correlated measurements. We leverage our deep understanding of power delivery issues with the precision of our AccuModels™, and utilize both time and frequency domain techniques to deliver more exact PDS analysis, and: tighter, smaller, lower-cost power delivery systems perfectly matched to any performance need.

Our thorough TeraPower™ methodology accounts for all factors significant to high-speed, and high performance power delivery designs, including:

• Application load characterization,
• Board stack-up,
• Board parasitics,
• Board resonances,
• Via geometry, and location,
• IC package stack-up,
• IC package parasitics,
• IC in-package and on-die storage,
• SSO transients,
• Bypass capacitor selection and location,
• VRM design.

As a result, a TeraPower™ PDS reliably delivers the power needed, when and where it is needed without either wasteful over-design, or hazardous under-design. Put the TeraPower™ design advantage to work in your product, and reap the rewards of robust power delivery at the lowest possible cost.

 

Home